New ASME Conference Addresses the Internet of Things

New ASME Conference Addresses the Internet of Things New ASME Conference Addresses the Internet of Things New ASME Conference Addresses the Internet of ThingsThe Internet of Things (internet of things), the concept that everyday items can have network connectivity and thereby have the ability to send and receive data, has been a growing topic of interest for the past several years. This June, ASME will launch a new conference that will explore the developments in intelligent hardware design that must occur in order to enable the Internet of Things to reach its full potential.The new conference, IoT Connect Intelligent Hardware, will be held June 20 and 21 at the Santa Clara Marriott in Santa Clara, Calif. The conference, which will feature the Information Storage and Process Systems (ISPS) Conference program and the InterPACK Pathfinder Workshop program, will explore advances in a wide range of applications from IoT and wearable devices, to automotive systems and high-performance co mputers and data centers that enable next generation computing needs for applications including bio-medical computation to weather prediction.Unlike other IoT-related conferences that concentrate on the cloud, software and IT infrastructure, ASMEs IoT Connect is intended to bring together hardware design engineers, manufacturers, systems architects, communications specialists and business leaders together to discuss IoT hardware which enables the existence of the cloud. In addition to having the opportunity to attend sessions covering such important issues as security for IoT data storage, packaging, transportation, and thermal mitigation, attendees will also have the gelegenheit to network with peers and discuss collaboration on IoT research activities.IoT Connect will also feature a number of keynote presentations from experts who will share their insights on developments in IoT hardware. Keynote speakers currently scheduled to appear at the conference include Scott Scheeler, vice president of switching hardware at Cisco Systems Steve Campbell, chief technology officer at Western Digital Co. Tom Bradicich, vice president and general manager for servers and IoT systems at Hewlett Packard Enterprise and Ken Hansen, president and chief technical officer at Semiconductor Research Corporation (SRC). Discount registration for IoT Connect, which also includes registration for the ISPS Conference and the InterPACK Workshop, is available through May 20. Visit www.asme.org/events/iot/register for more information. To learn more about IoT Connect, visit go.asme.org/iot.